10-17-2023, 12:37 PM
Compact-Size Box PC with Intel® Tiger Lake-UP3 Processor for Ultra Low-Power Fanless Solution
Intel® 11th Gen Tiger Lake-UP3 Embedded/Industrial SKU Series
2 DDR4 3200 MHz SODIMM Slots up to 64GB
Dual independent displays: DP++ , HDMI
2 2.5GbE LAN with RJ-45
1 M.2 B key (with NANO SIM-holder) support 5G/LTE, 1 M.2 E key
1 M.2 M key, 1 SATA 3.0 for storage (2.5” SSD)
4 USB 3.2 Gen 2, 4 USB 2.0, 4 COM (4 RS-485), 2 COM or 1 CANbus (Option by M.2 Module), DIO, Audio
Onboard TPM 2.0
6 opening reserved for antennas
Anti-Vibration & Shockproof Design to Compliance IEC 61373
Wide operating temperature: -20~70°C
Wide Voltage DC-IN 12~24V (OCP & OVP)
Ultra-Compact with fanless design
Intel® 11th Gen Tiger Lake-UP3 Embedded/Industrial SKU Series
2 DDR4 3200 MHz SODIMM Slots up to 64GB
Dual independent displays: DP++ , HDMI
2 2.5GbE LAN with RJ-45
1 M.2 B key (with NANO SIM-holder) support 5G/LTE, 1 M.2 E key
1 M.2 M key, 1 SATA 3.0 for storage (2.5” SSD)
4 USB 3.2 Gen 2, 4 USB 2.0, 4 COM (4 RS-485), 2 COM or 1 CANbus (Option by M.2 Module), DIO, Audio
Onboard TPM 2.0
6 opening reserved for antennas
Anti-Vibration & Shockproof Design to Compliance IEC 61373
Wide operating temperature: -20~70°C
Wide Voltage DC-IN 12~24V (OCP & OVP)
Ultra-Compact with fanless design