02-26-2023, 11:12 AM
4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots
2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs
3 PCIe 5.0 x8,
2 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 5.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
Dual LAN with 10GbE with Intel® X550
4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear)
Intel® C741 controller for 10 SATA3 (6 Gbps) ports
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots
2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs
3 PCIe 5.0 x8,
2 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 5.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
Dual LAN with 10GbE with Intel® X550
4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear)
Intel® C741 controller for 10 SATA3 (6 Gbps) ports