10-08-2022, 09:31 PM
CPU: Intel® Skylake/Kaby Lake 6th/7th generation Intel® Core™ U-series Mobile processor, FCBGA1356 package.
Memory: One DDR4 1866/2133 MHz SO-DIMM up to 16 GB.
Integrated Graphics: Intel® Gen 9 integrated HD Graphics.
LVDS interface: Onboard 24-bit dual channel LVDS connector with +3.3V / +5V supply
Serial ATA: Support 1 x SATA3 with 600MB/s (6Gb/s) transfer rate
Audio: Realtek ALC262 HD Audio
LAN Interface: 1 x Intel® I219-LM Gigabit PHY LAN (Support iAMT11.6).
Extended interface: One PCIe mini card socket or mSATA.
Internal I/O: 1 x SATA3, 1 x LVDS, 1 x LCD inverter, 1 x PS/2, 2 x RS232, 1 x LPC, 1 x Audio, 2 x USB2.0, 1 x DC Out, 1 x VGA for optional.
Rear I/O: 1 x LAN, 2 x USB 3.0, 1 x HDMI, 1 x Display Port for optional.
Power: DC input 5V ± 5%
Memory: One DDR4 1866/2133 MHz SO-DIMM up to 16 GB.
Integrated Graphics: Intel® Gen 9 integrated HD Graphics.
LVDS interface: Onboard 24-bit dual channel LVDS connector with +3.3V / +5V supply
Serial ATA: Support 1 x SATA3 with 600MB/s (6Gb/s) transfer rate
Audio: Realtek ALC262 HD Audio
LAN Interface: 1 x Intel® I219-LM Gigabit PHY LAN (Support iAMT11.6).
Extended interface: One PCIe mini card socket or mSATA.
Internal I/O: 1 x SATA3, 1 x LVDS, 1 x LCD inverter, 1 x PS/2, 2 x RS232, 1 x LPC, 1 x Audio, 2 x USB2.0, 1 x DC Out, 1 x VGA for optional.
Rear I/O: 1 x LAN, 2 x USB 3.0, 1 x HDMI, 1 x Display Port for optional.
Power: DC input 5V ± 5%